Machine de dépôt de cuivre de circuits électroniques / puces électroniques Système de pulvérisation par magnétron

Revêtement fonctionnel de films de PVD
December 13, 2022
Connexion De Catégorie: Machine PVD personnalisée innovante
Récapitulatif: Découvrez la machine avancée de revêtement de couches minces par pulvérisation PVD de nickel et de cuivre, conçue pour le dépôt de films conducteurs à haute efficacité. Idéale pour les circuits imprimés et les puces électroniques, cette machine offre une grande capacité, une fabrication précise et un contrôle entièrement automatisé. Parfait pour les industries comme le HBLED, les cellules solaires et l'électronique automobile.
Caractéristiques Du Produit Connexes:
  • Double-sided coating available with turnover fixture design for higher efficiency.
  • Large capacity of up to 2.2 ㎡ ceramic chips per cycle for bulk processing.
  • Fully automated operation with PLC and touch screen for easy ONE-touch control.
  • Equipped with 2 magnetic suspension molecular pumps for fast starting and maintenance-free operation.
  • Octagonal chamber design optimizes space, allowing up to 8 arc sources and 4 sputtering cathodes.
  • High heating power ensures optimal performance during the coating process.
  • Ideal for DPC process applications like HBLED, solar concentrator cells, and power semiconductor packaging.
  • Lower production costs compared to traditional methods like DBC, LTCC, and HTCC.
FAQ:
  • What industries can benefit from this PVD sputtering machine?
    This machine is ideal for HBLED, substrates for solar concentrator cells, power semiconductor packaging, automotive motor control, hybrid and electric automobile power management electronics, and RF microwave devices.
  • What are the key advantages of the DPC-RTAS1215+ model?
    The DPC-RTAS1215+ offers higher efficiency with double-sided coating, large capacity, fully automated control, and lower production costs due to features like magnetic suspension pumps and optimized chamber design.
  • How does this machine compare to traditional coating methods?
    The PVD sputtering technology used in this machine provides lower production costs and higher efficiency compared to traditional methods like DBC, LTCC, and HTCC, making it a superior choice for conductive film deposition.